BEI Kimco Magnetics - Voice Coil Actuators & DC Motors for Industrial, Aerospace/Defense, and Transportation Applications

Industrial

BEI Kimco Magnetics has merged leading-edge capabilities and cost-effective manufacturing know-how with highly personalized applications expertise. This combination has propelled BEI Kimco into market dominance where we have remained a leading manufacturer of brushless DC motors and linear and rotary voice coil actuators for over 20 years.

In that time, we have put thousands of BEI Kimco motors and actuators into products in markets ranging from medical/lab science, optics, fast beam steering, and electronics/semiconductor equipment to office and factory automation equipment.

Office/Factory Automation
In-process inspection, microlithography, robotics, pick and place machines, conveyor drives, portable tools, fixed power tools

Medical Science/Lab Instrumentation
Surgical equipment, analytical instruments, oxygen concentrators, respirators, gas detection equipment, fluid pumping systems, automated prescription dispensing, CPAP, lens grinding, prescription glasses, ventilators, spectrometry, chromatography.

Optics
Laser focusing, x-y tables, stage drives, auto focus mechanisms

Fast Beam Steering
DMD equipment, cross blade flexure, slotted bobbin, open loop bode response

Wire Bonding Equipment
Semiconductor processing equipment and wire bonding

Electronics/Semiconductor Equipment
Semiconductor processing equipment manufacturers are striving to achieve several goals. Their equipment must deal with shrinking feature sizes, requiring an increasing level of precision in the positioning ability of the machinery. At the same time, higher throughput is demanded of the system. This necessitates faster mechanisms, which tends to oppose the goal of superior precision. They must also compete in a global marketplace, which requires that they keep the costs as low as possible, while making faster, more precise mechanisms.

BEI Kimco was able to leverage its strength in magnetic voice coil actuators to enable the latest generation of automated wire bonders. These wire bonders make the necessary connections between the internal die of an integrated circuit and the outside leads that exit the chip package. Current processor chips can take high tens of connections per device. This makes bonding speed very important for volume production. Placement, accuracy and reliability are also absolutely important to help achieve the desired yield and reliability for the devices being manufactured.